Módulo refrigerado para transporte de vacinas em automóveis
The transport of substances which require a control of temperature, such as vaccines, must follow accurately the manufacturer's specifications. However, it’s still common the transport of vaccines in automobiles be made in boxes with ice and without temperature control. The Peltier chip is an e...
| Principais autores: | Plovas, Ricardo, Oliveira, Djalma Ageu Alves de |
|---|---|
| Formato: | Trabalho de Conclusão de Curso (Graduação) |
| Idioma: | Português |
| Publicado em: |
Universidade Tecnológica Federal do Paraná
2020
|
| Assuntos: | |
| Acesso em linha: |
http://repositorio.utfpr.edu.br/jspui/handle/1/16915 |
| Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|
| Resumo: |
The transport of substances which require a control of temperature, such as vaccines, must follow accurately the manufacturer's specifications. However, it’s still common the transport of vaccines in automobiles be made in boxes with ice and without temperature control. The Peltier chip is an electronic component that consists of two junctions of semiconductor material which generates heat in one of its faces and cooling in another when supplied with a 12 Vdc tension. This study aimed to develop a module for refrigerated transport vaccines in automobiles, whose internal temperature should range between 2º and 8º C. The internal cooling was made by chip Peltier. Was conducted a bibliographical survey about the components used in this project, and practice tests in Peltier chips to define what is the most suited for the project and know your limits. These tests included the use of different models of dissipators. To maintain this temperature was necessary to create an additional layer of polyurethane, which acts as a thermal insulator. The internal temperature of the module was monitored by using a temperature sensor (LM35) and a microcontroller which is programmed to make sensor readings and send this information to readable on an LCD display. The results indicated that the chip tec1-12705 showed lower consumption and also the lowest temperature measured in the cold side, which was -9,6º C. The use of different models of dissipators showed that the dissipator should have a contact area less than the area of the tablet for maximum utilization of cooling. Therefore we conclude that the use of Peltier chips for this purpose is certainly viable, as well as being simple and practical use. |
|---|